2012-03-07

Mo-Cu Wafer Substrate for LED Chips

Newly, Plansee High Performance Materials has utilized Mo-Cu R670 to develop a new molybdenum-copper composite material for semiconductor wafer substrates. With Mo-Cu R670, the new material has optimised heat dissipation in LED chips, as well as the same coefficient of thermal expansion as sapphire, and therefore reduces defects in the semiconductor structure which can occur during the hot bonding process. Commonly, the production of blue spectrum chips- including white LEDs - GaN-based semiconductor layers are grown on sapphire substrate (Al2O3) using epitaxial ...
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Tokushima, Japan - 6 March 2024: Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, has started mass production of the new UV-B (308nm) and UV-A (330nm) LEDs in its popular 434 Series packa... READ MORE

New XLamp® S Line LEDs enhance growth, last longer, lower energy costs Horticulture and other forms of agricultural lighting require application-tuned ratios of spectral content, high efficacy and long lifetimes. Whether you are interested... READ MORE