2013-06-18

DuPont Circuit & Packaging Materials Brings New Production Capability Online for CooLam®

Taiwan-based Expansion to Boost Supply of Advanced Thermal Substrates for LED Lighting   DuPont Circuit & Packaging Materials, part of DuPont Electronics & Communications, announced today that it has increased its ability to produce and supply DuPont™ CooLam® thermal substrate products by more than seven times its previous level, to better serve its customers in the fast-growing global Light Emitting Diode (LED) lighting market.  DuPont™ CooLam® thermal substrates are designed to dissipate heat in LED lighting appli...
Continue reading

The question of what makes a building "smart" has been debated in the industry for years. ams OSRAM provided a clear answer at Light + Building 2026: it is light — not as illumination, but as a sensory nervous system. It percei... READ MORE

ams OSRAM has entered with its OSRAM brand licensing program into a new partnership for general lighting components. Under the agreement, Eaglerise, a well-established Chinese company, is granted a license under the OSRAM brand for general lig... READ MORE