2013-07-12

Dowcorning Introduces OE6662 Encapsulant to Promote the Development of SMD Products

In recent years, LED epitaxy and chip technology, the phosphor preparation and application, and the high thermal conductive stent technology have achieved rapid development, however, there has the following technology and new trends in the field of SMD package: high current drive, high power, medium / large size, high thermal conductivity brackets and higher requirements on lighting quality. For the new trends of LED SMD packaging market, as a global leader in silicones, silicon-based technology and innovation, Dow Corning introduced OE6662 organic silicon encapsulation ...
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This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE