2013-09-17

Philips Discusses Future Developments in Packaging

The advancement in LED wafer and packaging technology and continual decrease in price is the driver for the upcoming lighting era. Philip SSL Fellow George Craford pointed out that LED packaging component prices have been dropping following the increase in energy efficiency.
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A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE