2013-09-17

Philips Discusses Future Developments in Packaging

The advancement in LED wafer and packaging technology and continual decrease in price is the driver for the upcoming lighting era. Philip SSL Fellow George Craford pointed out that LED packaging component prices have been dropping following the increase in energy efficiency.
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Samsung Electronics Singapore demonstrated its ongoing commitment to the future of virtual production in Southeast Asia and Oceania with a showcase of The Wall for Virtual Production (IVC series) in Singapore. Developed in collaboration with A... READ MORE

ams OSRAM, in cooperation with Marelli, has partnered with the Chinese EV manufacturer NIO to integrate ams OSRAM’s advanced EVIYOS™ HD25 intelligent multi-pixel LED solution used in Marelli's h-Digi® microLED modules into ... READ MORE