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2013-09-17

Philips Discusses Future Developments in Packaging

The advancement in LED wafer and packaging technology and continual decrease in price is the driver for the upcoming lighting era. Philip SSL Fellow George Craford pointed out that LED packaging component prices have been dropping following the increase in energy efficiency.

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1 [News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards
2 [News] Samsung Celebrates the Inaugural Season of TGL Presented by SoFi: Defining a New Era of Golf
3 [News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation
4 [News] Seoul Viosys Ranked Global No.1 in UV LEDs for Six Consecutive Years
5 [News] JBD Sets a New Benchmark for MicroLED Micro-Display Technology: No More Than Three Defective Pixels per Panel—A Record Low for the Industry
6 [News] Loxo Selects Aeva to Power Autonomous Delivery Vehicles
7 [News] AUO follows Samsung, Sony Honda in Micro LED adoption

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[News] Illuminating Change: LEDVANCE’s Third Sustainability Report Highlights Progress in Innovation and Digital Transformation

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

[News] Nichia's Cube Direct Mountable Chip Wins LightFair Innovation Awards

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE

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