2013-11-06

Low Price Trend Leads to Surge in Package Free Technology

With the continual low price trend of  in the LED market, manufacturers are beginning to consider options for lowering productions costs. LED package free products have become the focal point of the industry in 2013 with many manufacturers actively breaking into R&D and production.
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2013-09-18

Formosa Epitaxy Begins Package Free Chip R&D

To welcome the LED lighting era, Taiwan LED wafer manufacturer Formosa Epitaxy (ForEpi) Project Manager Li Renzhi stated that as the LED industry develops into an M shaped trend, highly priced but small volume products have occupied one end of the spectrum and products with large volume but pricing considerations are on the other. Continuing reduction in price for LED chips has lead to manufacturers entering into package free wafer R&D. ForEpi’s launched their Package Free Chips and through high efficiency, large luminosity angles, and more plan to break into the LED market.
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Vehicle interiors are changing fundamentally. Displays are becoming larger, surfaces smarter, and light is evolving from a design element into an intuitive communication surface. With the new ALIYOS™ Bond Vision demonstrator, ams OSRAM i... READ MORE

Macroblock and Juxin Optoelectronics successfully held 2026 LED Display Symposium at the Shenzhen Marriott Hotel. In addition to the main-stage sessions, which focused on display industry trends and technology sharing, the exhibition area feature... READ MORE