2013-10-14

DARPA Injects US$15.50 Million into Semiconductor and Chip R&D

Defense Advanced Research Projects Agency (DARPA) has invested another US$15.50 million into future R&D of semiconductors and chips, according to a blog entry by Michael Cooney, Online News Editor for Network World.
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The number of modern applications using 3D sensor technologies is steadily increasing, including ambient sensing for industrial robots, various face recognition applications, object detection, and machine vision. Vertical Cavity Surface Emitti... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LED, is pleased to announce that a UV-C LED disinfection device manufactured by Mutoh Industries Ltd., equipped with Nichia's high-power 28... READ MORE