2013-10-14

DARPA Injects US$15.50 Million into Semiconductor and Chip R&D

Defense Advanced Research Projects Agency (DARPA) has invested another US$15.50 million into future R&D of semiconductors and chips, according to a blog entry by Michael Cooney, Online News Editor for Network World.
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A jointly developed demonstrator from ams OSRAM and DP Patterning points to where automotive lighting networks are heading: single-layer flexible printed circuit boards (FPCBs) instead of complex multilayer designs — and, in the structur... READ MORE

ams OSRAM, a global leader in lighting and sensing innovation, announced that its next-generation HDR flicker detection sensor has been integrated into the newly released Honor Magic 8 flagship series. Featuring ultra-high sensitivity, precisi... READ MORE