Japanese technology has always been under the global spotlight and recognized as a worldwide trend indicator. LEDinside observed flip chip LED and EMC will become the major development trend this year among manufacturers display and release of related equipment and material at Lighting Japan 2014, which took place at Tokyo Big Sight earlier this month. Below is LEDinside observations and trend analysis while interviewing equipment, material, and package manufacturers at the trade show:

The maturation of LED technology and lighting applications have allowed flip-chips to become the star of 2013. Genesis Photonics Inc. (GPI) has been producing flip chip products for over three years. In 2013, the company expanded into the new field of flip chip packaging and its development direction has been technological vertical integration. Elimination of wire bonding during the manufacturing process can effectively reduce LEDs damage risks. GPI plans to continue introducing flip chips into special application markets for street lights, tunnel lighting, and factory lighting, which require products with high reliability.

Korean manufacturers are still planning to increase direct-type LED TV shipment volumes, according to LEDinside, a research subsidiary of global research institute TrendForce. In addition, as Chinese Lunar New Year approaches in January, most LED manufacturers are working hard to release higher Price/Performance (P/P) products in 2014. In face of fierce competition and conventionally low season in 2014, companies are developing new flip chip LED and EMC package technologies to increase their competitiveness.