As 2013 comes to a close, LED lighting demands have sky rocketed. The industry has finally gotten past two years of harsh winters  to welcome a warm spring. While LED upstream manufactures have been busy with flip-chip technology, LED package manufacturers have not been idle either. Introducing EMC lead frames into package manufacturing process has become the main target for many manufacturers.

With the LED lighting market booming and  LEDs in backlight spec changes, the mid power spec market had taken center stage within the LED industry this year, already surpassing the high power market in initial output value. LED drivers with EMC lead frames can reach 1-2W power output which can supply the mid power and mid/high power LED market. LED package manufacturers are expanding EMC production capacity. After improvements to PCT lead frame materials, LED package manufacturers plan to introduce PCT products into the mid power market. Flip-chip products are also making their way  in the 2014 mid power market.