2013-12-12

Philips Lumileds: Chip Scale Packaging for LEDs

PhD. Bhardwaj Jyoti, Senior Vice President, R&D, Philips Lumileds gives detailed information about the development of chip scale package technology in this article. Chip scale packages are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Si ICs was driven by miniaturization, improved thermals, higher reliability, and simply the need to connect to an ever increasing pin-count on an ever shrinking die. Chip Scale packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging. It is therefore a natural evolution for such packaging innovation to proliferate into other industries including the LED product space and therefore not surprising that Chip-scale packaging has made inroads into the LED industry as recently released by Philips Lumileds. 
Continue reading

This year's report plays a key role in aligning with the upcoming standards of the European Union and is built on a significantly broader data foundation than in previous years. For the first time, the report includes all LEDVANCE entities... READ MORE

Nichia, the world's largest LED manufacturer and inventor of the high-brightness blue and white LEDs, is pleased to announce that Cube Direct Mountable Chip received the LightFair Innovation Awards in the LED Chips & Modules category. ... READ MORE