Japanese LED chip manufacturer Nichia’s first flip chip LED product, set to be launched in October this year, will be one ninth the size of the average flip chip, said the company’s optoelectronic division chief technology officer today at a press conference at Hotel Okura in Taipei, Taiwan.

The LED lighting industry is transforming. As LED lighting develops, new technology, applications, and models will drive a revolution in the production process of the industry. Industry insiders have weighed in on the future of the industry at the New LED Technology Conference held by the Shenzhen Light Emitting Diode Industry Association. With more new chip scale packaging (CSP) technology springing up, industry insiders believe that the industry chain consolidation process will accelerate. 

PhD. Bhardwaj Jyoti, Senior Vice President, R&D, Philips Lumileds gives detailed information about the development of chip scale package technology in this article. Chip scale packages are novel to the LED industry but they are the mainstay of the semiconductor industry. Development of CSP in the Si ICs was driven by miniaturization, improved thermals, higher reliability, and simply the need to connect to an ever increasing pin-count on an ever shrinking die. Chip Scale packages also enabled a reduction in device parasitic and allowed for ease of integration into Level 2 packaging. It is therefore a natural evolution for such packaging innovation to proliferate into other industries including the LED product space and therefore not surprising that Chip-scale packaging has made inroads into the LED industry as recently released by Philips Lumileds.