Oxygen sensing in industrial applications as gas sensing in power plants benefit from integrated and robust VCSEL solutions // Spectroscopic sensors with in-situ measurement in less than a second // No thermal sensitivity with temperature controlled VCSEL in TO packages // New oxygen sensing solutions with wavelengths of 760 nm and 763 nm with improved performance Ulm, May 23, 2022 – TRUMPF Photonic Components, a global leader in VCSEL and photodiode solutions, is introducing its next generation of VCSEL for spectroscopic oxygen sensing. Spectrosc...

Increasing demand in VCSELs for smartphones and consumer electronics // New VCSEL solutions for high quality proximity sensing, laser auto focus and under OLED display sensing applications // New generation of 940 nm single-mode and multimode VCSEL released Ulm, April 05, 2022 – TRUMPF Photonic Components, a global leader in VCSEL and photodiode solutions, presents new advanced VCSEL solutions to expand its portfolio for 3D sensing in consumer and industrial applications. The new generation 940 nm VCSEL arrays enable breakthrou...

Artilux, renowned for being the world leader of GeSi photonic technology, has been at the forefront of wide-spectrum 3D sensing and consumer optical connectivity since 2014. Established on fundamental technology breakthroughs, Artilux has been making multidisciplinary innovations covering integrated optics, system architecture to computing algorithm, and emerged as an innovation enabler for smartphone, autonomous driving, augmented reality and beyond. Our vision is to keep pioneering the frontier of photonic technologies and transform them into enrichment for real life experience. We...

Available in an industry-standard package with multiple fields of illumination, flexible peak power, and integrated monitoring for closed loop control and eye-safety functionality SAN JOSE, Calif., Oct. 21, 2021 /PRNewswire/ -- Lumentum Holdings Inc. ("Lumentum"), a leading provider of innovative 3D sensing components, today announced an industry first, 10 W flood illuminator module that incorporates a high-performance three-junction vertical-cavity surface-emitting laser (VCSEL) array for consumer and industrial 3D sensing application...

Analog Devices announced a strategic collaboration with Microsoft to leverage Microsoft’s 3D time-of-flight (ToF) sensor technology, allowing customers to easily create 3D applications that bring higher degrees of depth accuracy and work regardless of the environmental conditions in the scene. ADI’s technical expertise will build upon Microsoft Azure Kinect technology to deliver leading ToF solutions to a much broader audience in areas such as Industry 4.0, automotive, gaming, augmented reality, computational photography and videography. Currently, the indu...

In early 2020, TrendForce forecasted the release of more than 10 high-end smartphone models equipped with 3D sensing solutions this year, which would drive up 3D sensing VCSEL revenue* to US$1.404 billion. However, as the COVID-19 pandemic put a damper on global smartphone shipment, and the Indian consumer market exhibited strong demand for entry-level and mid-range smartphone models, smartphone brand vendors have subsequently slowed down their pace of integrating 3D sensing solutions into high-end models. TrendForce is revising its forecasted 3D sensing VCSEL (fo...

STMicroelectronics announced the extension of its FlightSense ToF ranging sensors by introducing the VL53L3CX which allow measuring distances to multiple objects and increasing accuracy. Meanwhile, the company also introduced a reference design suited for monitoring social distancing and assuring remote operation to protect human health in all environments in response to global or local pandemic conditions. The ToF sensor VL53L3CX measures object ranges from 2.5 cm to 3 m, allowing designers to introduce features like occupancy detectors or reporting the exact distanc...

Osram revealed an intelligent emitter module for 3D sensing which allows smartphones to take high-quality images and videos with staggered depth of field. Besides optimizing image content, the module can also be used for 3D object recognition or AR applications. The product is designed to strengthen camera function of smartphones. Innovative functionalities of mobile devices require components to fit into ever smaller spaces. A central task for manufacturers has been to find the right emitters, photodiodes and VCSEL driver chips (ICs), then calibrate them and finally insta...

COVID-19 pandemic has led to lockdowns across the world with pause in business operation and production, resulting enormous impact globally. The technology industry, as one of the most affected field, not only needs to tackle the challenges brought by the coronavirus but also has to reconsider its strategies and operating plans for the post-pandemic world. As for the LED industry, since the supply chain mostly locates in Asia with the majority of production coming from China, plus high inventory due to oversupply in the past few years, the coronavirus epidemic has relatively s...

Researchers have developed the first megapixel photon-counting camera based on new-generation image sensor technology that uses single-photon avalanche diodes (SPADs). The new camera can detect single photons of light at unprecedented speeds, a capability that could advance applications that require fast acquisition of 3D images such as augmented reality and LiDAR systems for autonomous vehicles. "Thanks to its high resolution and ability to measure depth, this new camera could make virtual reality more realistic and let you interact with augmented reality information in ...

Infineon Technologies has collaborated with software and 3D Time of Flight (ToF) system specialist pmdtechnologies to develop the world’s smallest 3D image sensor, and is presenting it at CES 2020 in Las Vegas. The new REAL3™ single-chip solution measures 4.4 x 5.1 mm, allowing it to be incorporated into small size devices to provide high resolution data with low power consumption. (Image: Infineon) “With the fifth generation of our REAL3™ chip we are once again demonstrating our leading position in the field of 3D sensors,” sa...

Shanghai Orient-chip Technology (OCS) is a deep tech company that focuses on integrated IC and optoelectronics product. Headquarters of the company are in Shanghai, China and its R&D centers locate in Shanghai, Taipei and Hsinchu. OCS’s IC and optoelectronics R&D teams focus on TX total solution for Time of Flight (TOF) since 2015. They developed a series VCSEL package for TOF that integrates metal holder and brings two advantage. First, heat dissipation on metal holder product is better then plastic holder product. Second, metal holde...

According to the latest Infrared Sensing Application Market Trend Report by LEDinside, a division of TrendForce, seeing that smartphone shipments are predicted to decline for whole 2019 year, cell phone brands will be engaging in a 'specs -contest' with their flagship devices for the second half-year, and 3D sensing modules will become an important component in that race. Market revenue for VCSELs used by cell phones utilizing 3D sensing is projected to reach US$1.139 billion as a result of this trend. “For 2019, besides Apple, who will be implementing...

ams announced the launch of MERANO-Photodiode (PD), an in-frared (IR) laser flood illuminator module which provides the uniform light output needed in mobile 3D sensing applications such as user face recognition. By introducing a VCSEL-based flood illuminator in a slim package, ams aims to ehance the adoption of 3D sensing applications in mainstream mobile phones. Its 2W Merano-PD is suitable for use in the latest technologies for 3D sensing, including ToF and structured light methods. Applications such as face recognition, augmented reality, 3D object scannin...

Austrian sensing solution provider ams announced that it will showcase several industry-first technologies for mobile devices at Mobile World Congress (MWC) 2019 in Barcelona during February 25 -28. ams will demonstrate state-of-the-art sensor solutions for mobile, computing and consumers including 3D sensing technology, behind screen solution color sensors and medical-level wearable devices. The industrial and automotive applications of these technologies will also be presented by ams. (image: ams) The 3D sensing technologies for mobile devices include active stereo ca...

Photonics West 2019 is the largest photonics exhibition in the world held annually in San Francisco. According to the exhibitors at the show, LEDinside learnt that the main technical challenges of VCSEL include power conversion efficiency (PCE), temperature drift, slope efficiency, and light field design. Most of the exhibitors at the show have achieved a power conversion efficiency of 40% for VCSEL products of 1-2W. Among them, Lumentum said it will continue to increase conversion efficiency to 43% in this year. LEDinside was honored to interview Somit Jos...

ams announced its cooperation with Face++, a Chinese AI software developer, to accelerate OEMs’ and system integrators’ deployments of 3D optical sensing technologies such as face recognition. According to ams, the partnership with Face++ will enable manufacturers to bring facial recognition and other systems to market faster including functions like facial payments, Animoji creation and augmented/virtual reality. The 3D optical sensing solutions created by ams and Face++ use infrared light projectors to map the surface of real-world objects such as a user’...

Sensor solutions provider ams announced that it will exhibit new sensing technologies for the mobile devices, computing, consumer electronics and automotive sectors at CES 2019. With its theme, ‘Sensing is Life,’ ams is going to introduce sensor solutions including medical-grade wearable devices that monitor blood pressure; 3D technology for smart phones, computing, automotive and robotics; behind OLED solutions for bezel-less phones; color sensors that enhance pictures to professional levels; earbud technology for a relaxing ANC experience (digital and analog) ...

Osram has debuted new VCSELs for applications like 3D scanning and imaging. The new products, PLPVCQ 850 and the PLPVCQ 940, are the latest additions to Osram’s Bidos product family. VCSELs combine the high power density and simple packaging of an IRED with the spectral width and speed of a laser. With the focus on high tech development, Osram Opto Semiconductor has targeted VCSEL application include machine vision or facial recognition, as well as object or architectural scanning that involves mapping an area in 3D and positioning virtual fu...

Apple has applied a patent related to optoelectronics devices for improving LiDAR sensors and applications, reported Patently Apple. The report said that Apple noted the demands for applications using 3D sensing and imaging systems and proposed enhanced technologies to integrate LiDAR and VCSEL for advanced 3D image technology. The new patent introduce a method to combine different types of light source and laser array such as diffractive optical elements or VCSEL to develop improved 3D image devices for various applications. (Image: Apple) Patently Ap...

VPED (Visual Photonics Epitaxy Co. Ltd), a Taiwan-based GaAs wafer producer, announced that the company expects growth momentum from the applications of VCSEL and will begin to ship small volumes of 5G products next year. As the smartphone market has passed its peak phase, semiconductor suppliers are looking forward to the applications of IoT and 5G. However, the development of these fields has just begun, bringing limited momentum to the industry. As result, the growth of VPED would still come from VCSEL applications including 3D facial recognition and L...

ams, a high performance sensor solutions provider, has cooperated with Qualcomm Technologies to focus on the development of a 3D depth sensing camera solution for mobile phone applications such as 3D imaging and scanning and biometric face authentication. The two companies aim to dedicate their technology expertise and engineering force to design a 3D stereo camera solution for Android-based mobile phones. ams provides its VCSEL light sources and optical IR pattern technology on the base of Qualcomm’s Snapdragon™ Mobile Platforms to suppourt various applicati...

Philips Photonics announced that the company has reached a milestone of shipping one billion VCSELs thanks to strong growth in smartphone 3D sensing applications. With strong drives from the trends of proximity sensing and 3D facial recognition technology in consumer smartphones, the company also unveiled its plan to increase production capacity. According to Philips Photonics, it has doubled its production capacity by early 2018, which was in line with the company’s plan. Now Phiilips Photonics plans to further expand its production at the facility in Ulm, Germany...

Lextar has announced that it is going to launch a series of VCSEL products for 3D sensing applications including facial and gesture recognition, people detection, and driver fatigue detection. Lextar’s VCSEL products include the PV88M component series which emit light for 3D depth-sensing module. The series provides various wavelengths, different levels of brightness and package sizes while offering a beam angle selection from 45 to 100 degrees. According to Lextar, the product can also be customized to meet the needs of its clients. (Image: Lextar) The ...

Optoelectronic component producer II-VI Inc. announced on November 9th that it is going to acquire Finisar, the supplier of optical communication products for Apple with a deal worth US$3.2 billion cash and stock.

Laser Taiwan 2018 launched its opening today (October 17th) and exhibitors from all over the world are participating in the event to showcase their cutting edge technologies and equipment. VCSEL is the focal point of the event following the trend of 3D sensing applications.

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Numerous orders are flowing to 3D sensing component suppliers including Lumentum and Win Semiconductor because of the boom in 3D sensing in 2018. Placed by Apple and other application makers, those orders are bringing fortune to suppliers.

Apple has introduced 3D sensing modules in iPhone X for the first time, together with neural network embedded in its A11 chip. 3D sensing modules record three-dimensional data while A11 chip processes large amounts of data, allowing iPhone X to learn and identify a variety of facial details and expressions. The modules also ensure that users can be correctly identified even when their appearances change, making it more difficult to counterfeit.

One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies the unlock-with-your-face feature becomes smarter, faster and more reliable.